HBM 和先进封装需求旺盛，带动半导体硅片需求倍增
https://www.icsmart.cn/79464/
https://www.trendforce.com/~
省流：上游晶圆厂想涨价![[News] HBM and Advanced Packaging Expected to Benefit Silicon Wafer](/static/https://cdn4.telesco.pe/file/SGmbnpTaltgainnrKIlBpLetQ9fCDoQQA6fhr81PejCU6RXr2rN0vrXHHC36xI1olJ4grEDuSlHttAQXfWNX18mEy7b7mN1PkJf1AfSguEsE21dUZ0fvybQ6xTTVUcBTmvICKUeBPiRUW1UYkySN8QnBZZQzYodSlc8B4wsYY4EAP3G3BlSUPLIGQEDcmyon0zTKDLBUmhdEz65xQzierZdQF0q4WbYtYFQ46k9kk8NaqXkhIr6yV4m8yiUnUFcFN0oTsR1_o7uuLuEn15qwxxh7Xh3nrYG5j4XlNfi8tv6j_UOemXAm7d5U7jpU8iUXQvSfDSS-08uqzB670fAS4g.jpg)
https://www.icsmart.cn/79464/
https://www.trendforce.com/~
省流：上游晶圆厂想涨价
TrendForce
[News] HBM and Advanced Packaging Expected to Benefit Silicon Wafer
As artificial intelligence (AI) technology enjoys rapid advances, the demand for AI chips is skyrocketing, driving continuous improvements in advanced...
