三星计划在 HBM4 上引入 3D 封装技术
https://www.trendforce.com/~
现在 HBM 是用2.5D封装，HBM和GPU在同一平面，挨得很近，用硅中介层连接；
3D封装是把HBM直接叠在GPU上，就像 AMD 3D V-Cache 那样。![[News] Samsung Plans to Introduce 3D HBM Chip Packaging Service in 2024 | TrendForce News](/static/https://cdn4.telesco.pe/file/JyY2m-DU5Rhtg3pfrUN8Ryc9j2ujU8QpVX0alxWcTWbAttAG316kPty5a0J55z6GyXFEtUCqT3IBDzO1GYZbRzv625e2XpDi1Uoxfab-09gFRVYyFlnqjUZQPtQN1A-Nd-bBiLAmuQghYhB6J037MhwiW7IXwTqNyPnyk6MjihsJFQuyaydkGIE9Ea3l99Q9HJhuYnPJaIE1f2GLwwbyOmv4V1m9_O_IY8Fahv0w7o0TwgJCzpdu6yLnPr5ZEA-2XSo69INkbEEz-c1qqLTIGgBqLsnqxaiEZFVuWTzZH-vJKqB3QKMCQJtyAjcQdIGaN4MHWn2cHr3T7jQcVpboeg.jpg)
https://www.trendforce.com/~
现在 HBM 是用2.5D封装，HBM和GPU在同一平面，挨得很近，用硅中介层连接；
3D封装是把HBM直接叠在GPU上，就像 AMD 3D V-Cache 那样。
[News] Samsung Plans to Introduce 3D HBM Chip Packaging Service in 2024 | TrendForce News
In 2023, Samsung disclosed plans to launch its advanced three-dimensional (3D) chip packaging technology, which would be able to integrate memory and ...
